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electroplating chemical intermediates
(34)
electroplating brightening agent
(26)
Acid copper brightener
(9)
nickel electroplating chemicals
(27)
copper electroplating chemicals
(10)
electroplating chemicals
(1)
zinc electroplating chemicals
(3)
nickel electroplating intermediates
(31)
electroplating chemical additives
(36)
copper electroplating intermediates
(9)
zinc electroplating intermediates
(5)
nickel plating intermediates
(24)
copper plating intermediates
(10)
electronics chemicals
(45)
zinc plating intermediates
(5)
nickel plating chemicals
(27)
copper plating chemicals
(9)
nickel plating additives
(21)
copper plating additives
(14)
nickel electroplating additives
(32)
copper electroplating additives
(11)
zinc electroplating additives
(5)
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electroplating chemical intermediates
Nickel electroplating chemical intermediate Benzenesulfonamide(BBI) C12H11NO4S2 2618-96-4
Chemical intermediates for electroplating Butynediol ethoxylate (BEO) C8H14O4 1606-85-5
Chemical intermediate for electroplating Butynediol propoxylate (BMP) C7H12O3 1606-79-7
Nickel electroplating chemical intermediates 3-(Diethylamino)propyne(DEP) C7H13N 4079-68-9
electroplating brightening agent
Brightening agent for zinc electroplating DPE-Ⅲ
Plating brightening agent for zinc JC-9
Zinc electroplating brightening agent POLYQUATERNIUM-2 (WT) (C11H26N4O)n.(C4H8Cl2O)n
Brightening agent for copper plating purple dye (LZ-20C)
Acid copper brightener
Electroplating brightener N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine C14H32N2O4
Electroplating brightener 3-S-Isothiuronium propane sulfonate (UPS) C4H10N2O3S2
Acid copper brightener HGS Copper electroplating brightener
Acid copper brightener asta7100 Sodium 3-mercaptopropanesulphonate (MPS) C3H7O3S2Na
nickel electroplating chemicals
Nickel electroplating brightener 3-HEXYNE-2,5-DIOL (HD) C6H10O2 3031-66-1 EINECS:221-209-5
Nickel electroplating chemicals Triphenyl phosphate (TPP) (C6H5O)3PO
Chemical intermediates for electroplating 3-(Amidinothio)propionic acid (ATPN) C4H8N2O2S
Chemical intermediate for nickel electroplating Diethylpropargylammonium sulfate (TC-DEP)
copper electroplating chemicals
Copper electroplating leveling agent throwing agent basic purple dye LZ-20C
Copper electroplating chemical wetting agent leveling agent Polyether NP-2
Copper plating additives THIOFLAVINE T (basic yellow 1) C17H19ClN2S
Copper electroplating chemical intermediate 1,3-Propanesultone (1,3-PS) C3H6O3S
electroplating chemicals
Electroplating chemicals Sodium Saccharin C7H5NNaO3S CAS No.: 128-44-9
zinc electroplating chemicals
Zinc electroplating brightener quaternary ammonium-type cation Imidazole (IMZ)
Zinc electroplating chemicals N-BENZYLNIACIN (BPC) C13H11NO2
Zinc electroplating chemical Polyquaternium-2 (WT) (C11H26N4O)n.(C4H8Cl2O)n
nickel electroplating intermediates
Nickel electroplating brightener 3-HEXYNE-2,5-DIOL (HD)C6H10O2 3031-66-1 EINECS:3031-66-1
Chemical intermediates Propargyl-oxo-propane-2,3-dihydroxy (POPDH) C6H10O3
chemical intermediate 3-(2-butyne-1-ol)-sulfopropyl ether, sodium salt (HBOPS-Na)
Nickel electroplating additives Propargyl-3-sulfopropyl ether sodium (POPS) C6H9NaO4S
electroplating chemical additives
MPA Nickel electroplating chemical additives 1,1-dimethyl-2-propynylamin C5H9N 2978-58-7
(BS) Nickel electroplating chemical additives intermediates SACCHARINE C7H5NO3S 81-07-2
(VS) Electroplating chemicals additive SODIUM ETHYLENE SULFONATE C2H3O3S.Na 3039-83-6
TC-EHS chemical additives sodium 2-ethylhexyl sulphate C8H17NaO4S CAS No.: 126-92-1
copper electroplating intermediates
Copper electroplating leveling agent throwing agent basic purple dye LZ-20C
Copper electroplating chemical wetting agent leveling agent Polyether NP-2
Copper electroplating wetting agent leveling agent Polyether NP-1
Copper electroplating intermediate 3-S-Isothiuronium propane sulfonate (UPS) C4H10N2O3S2
zinc electroplating intermediates
Zinc electroplating leveling agent brightener derivative of 3-dimethyl aminopropyl amine
Zinc electroplating intermediate derivative of Polyaminesulfone (JC-9)
Zinc electroplating brightener quaternary ammonium-type cation Imidazole (IMZ)
Zinc electroplating intermediates N-BENZYLNIACIN (BPC) C13H11NO2
nickel plating intermediates
Nickel Plating Additives Pyridinium propyl sulphobetaine (PPS) C8H11NO3S
Nickel Plating Intermediates Pyridinium hydroxy propyl sulphobetaine (PPS-OH Solid) C13H22N2O6S
Nickel Plating Intermediates Butynediol ethoxylate (BEO) C8H14O4
Nickel plating intermediates Butynediol propoxylate (BMP) C7H12O3
copper plating intermediates
Copper plating intermediates Bis-(sodium sulfopropyl)-disulfide (SPS) C6H12Na2O6S4
Copper plating additives THIOFLAVINE T (basic yellow 1) C17H19ClN2S
Copper plating leveling agent throwing agent basic purple dye LZ-20C
Copper plating chemical wetting agent leveling agent Polyether NP-2
electronics chemicals
Nickel Plating additives Pyridinium propyl sulphobetaine (PPS) C8H11NO3S
Nickel Plating Additives Pyridinium hydroxy propyl sulphobetaine (PPS-OH Solid) C13H22N2O6S
Nickel Plating additives Butynediol ethoxylate (BEO) C8H14O4
Nickel plating Additives Butynediol propoxylate (BMP) C7H12O3
zinc plating intermediates
Zinc plating additives Polyquaternium-2 (WT) (C11H26N4O)n.(C4H8Cl2O)n
Zinc plating leveling agent brightener derivative of 3-dimethyl aminopropyl amine
Zinc plating intermediate derivative of Polyaminesulfone (JC-9)
Zinc plating brightener quaternary ammonium-type cation Imidazole (IMZ)
nickel plating chemicals
Nickel plating brightener 3-HEXYNE-2,5-DIOL (HD) C6H10O2 3031-66-1 EINECS: 221-209-5
Chemical intermediate for nickel plating Diethylpropargylammonium sulfate (TC-DEP)
Nickel plating chemicals Propargyl-3-sulfopropyl ether sodium (POPS) C6H9NaO4S
Chemicals intermediates for nickel plating CHLORAL HYDRATE (TCA) C2H3Cl3O2
copper plating chemicals
LZ-20C Copper plating leveling agent throwing agent basic purple dye
NP-2 Copper plating wetting agent leveling agent Polyether
Copper plating chemical additive 1,3-Propanesultone (1,3-PS) C3H6O3S 1120-71-4 214-317-9
Copper plating complexing agent N,N,N,N-Tetrakis(2-hydroxypropyl)ethylenediamine 102-60-3
nickel plating additives
Nickel Plating additives Pyridinium propyl sulphobetaine (PPS) C8H11NO3S
PPS-OH (Solid) Nickel Plating Additives Pyridinium hydroxy propyl sulphobetaine 3918-73-8
(BEO) Nickel Plating Additives Butynediol ethoxylate C8H14O4 1606-85-5 EINECS: 216-526-0
BMP Nickel plating intermediates Butynediol propoxylate C7H12O3 CAS NO. 1606-79-7
copper plating additives
Copper plating intermediates THIOFLAVINE T (basic yellow 1) C17H19ClN2S
NP-2 Copper plating chemical wetting agent leveling agent Polyether
NP-1 Copper plating wetting agent leveling agent Polyether
Copper plating chemical additive 1,3-Propanesultone (1,3-PS) 1120-71-4 EINECS: 214-317-9
nickel electroplating additives
Nickel electroplating brightener 3-HEXYNE-2,5-DIOL (HD) C6H10O2
Nickel electroplating chemicals additives intermediates SACCHARINE (BS) C7H5NO3S 81-07-2
Nickel electroplating additives Triphenyl phosphate (TPP) (C6H5O)3PO
Chemical additives for electroplating 3-(Amidinothio)propionic acid (ATPN) C4H8N2O2S
copper electroplating additives
LZ-20C Copper electroplating leveling agent throwing agent basic purple dye
NP-2 Copper electroplating chemical wetting agent leveling agent Polyether
(UPS) Copper electroplating additives 3-S-Isothiuronium propane sulfonate 21668-81-5
Copper electroplating N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine CAS NO.:102-60-3
zinc electroplating additives
Zinc electroplating leveling agent brightener derivative of 3-dimethyl aminopropyl amine
Zinc electroplating additive derivative of Polyaminesulfone (JC-9)
Zinc electroplating brightener quaternary ammonium-type cation Imidazole (IMZ)
Zinc electroplating additives N-BENZYLNIACIN (BPC) C13H11NO2
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Keywords :
nickel plating intermediates
BMP
Butynediol propoxylate
copper plating intermediates
THIOFLAVINE T
basic yellow 1
Pyridinium hydroxy propyl sulphobetaine
PPS-OH
Bis-(sodium sulfopropyl)-disulfide
SPS
copper plating additives
PA
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